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1、Click to edit Master title style,Click to edit Master text styles,Second level,Third level,Fourth level,Fifth level,*,線路板專業(yè)名詞解釋,Title,印制電路：,printed circuit,印制線路：,printed wiring,印制板：,printed board,印制板電路：,printed circuit board(,pcb,),印制線路板：,printed wiring board(,pwb,),印制元件：,printed component,印制接點：,pri

2、nted contact,印制板裝配：,printed board assembly,板：,board,第一篇：常用術(shù)語,10.,單面印制板：,single-sided printed board(,ssb,),11.,雙面印制板：,double-sided printed board(,dsb,),12.,多層印制線路板：,mulitlayer,printed wiring board13.,剛性印制板：,rigid printed board14.,剛性單面印制板：,rigid single-sided printed board 15.,剛性雙面印制板：,rigid double-sid

3、ed printed board17.,剛性多層印制板：,rigid,multilayer,printed board,18,.MI:Manufacture Instruction(制作指示),19,.ECN:Engineering Change Notice,(工程更改通知),20,.MOR：Marketing Order Release,OC :Order Confirmation(定單),21,.IPC-The Institute for Interconnecting,and packaging Electronic Circuits,(美國電子電路互連與封裝協(xié)會),22.,UL,:U

4、nderwrites Laboratories(,美國保險商實 驗所),23.,ISO,-International Standards Organization,國際標準化組織,24.,On hold and Release,:,暫停和釋放,25.,SPEC,:specification,客戶規(guī)格書,26.,WIP,:Work in process,正在生產(chǎn)線上生產(chǎn)的 產(chǎn)品,27.,Gerber file,:,軟件包,28.,Master A/W,:,客戶原裝菲林,29.,Net list,:,客戶提供的表明開短路的文件,30.,HMLV,:High Mixed Low Volume,多批少

5、量,31.,TCN：Temporary Change notice,臨時更改通知,32,.ENIG:Electroless Nickel/Immersion Gold,(IPC-4552),33,.OSP:Organic Surface protection,34,.,I,T,:,I,mmersion,Tin,35.,IS:Immersion Silver,36.,HAL:Hot air leveling,第二篇：有關(guān)材料,1.,Copper-clad Laminate,:,覆銅箔基材,2.,Prepreg,:,聚酯膠片,3.,FR-4(Flame Retardant-4),:,一種用玻璃布和

6、環(huán)氧樹脂制造有阻燃性能的材料,4.,Solder mask,:,阻焊劑,5.,Peelable,solder mask,:,藍膠,7.,Dry film,:,干膜,6.,Carbon Ink,:,碳油,8.,RCC,:Resin Coated Copper(,不含玻璃布),9.基材：,base material,10.,層壓板：,laminate,11.,覆金屬箔基材：,metal-clad bade material,12,、,覆銅箔層壓板：,copper-clad laminate(,ccl,),13,、,單面覆銅箔層壓板：,single-sided copper-clad laminat

7、e,14,、,雙面覆銅箔層壓板：,double-sided copper-clad laminate,15,、,復合層壓板：,composite laminate,16,、,薄層壓板：,thin laminate,17,、,金屬芯覆銅箔層壓板：,metal core copper-clad laminate,18,、,金屬基覆銅層壓板：,metal base copper-clad laminate,第三篇：有關(guān)工序,PTH,1.,PTH:,(Plated through hole),電鍍孔,A.,Via hole,:,通路孔。,作用：,B.,IC hole,:,插件孔。,作用：,僅作為導通用

8、（不作插件或焊接），如測試點和一般導通孔。,用于插件或焊接，也可導通內(nèi)外層。,2.,NPTH：,作用：,一般是作為裝配零件的定位孔或工具孔。,NPTH,(,Non-plated through hole),非電鍍孔,3.,SMT/SMD,Surface Mounting Technology:,表面貼覆技術(shù),SMT Pad:,SMT,指在線路板表面帖覆焊接元件的,Pad，,包括,QFP(Quad flat pad)，2-Roll,等。,這些也是,SMT pad,4.,BGA/CSP:,BGA-Ball Grid Array,CSP-Chip Scale package,要求：,一般,BGA,區(qū)

9、域,VIA,孔要求塞孔,說明：,它們都是一種封裝技術(shù)。在,PCB,上都表現(xiàn)為一 VIA孔聯(lián)了一個焊接PAD。,BGA/CSP,BGA Pad,Line,Via Hole,5.,Fiducial,mark:,作用：,裝配時作為對位的標記,說明：,它是非焊接用的焊盤，通常為圓形或方形，有金屬窗和綠油窗。,Fiducial,mark,6.,Dummy pattern(thief pattern)：,作用：,使整塊板的線路分布更均勻，從而提高圖電質(zhì)量和減少板的曲度和扭度,。,要求：,通常以不影響線路為標準，,一般為又有三種：,圓形/方形-命名為“,Dummy”,網(wǎng)狀-命名為“網(wǎng)狀,Dummy”,銅皮-

10、命名為“銅皮”,Dummy,7.無孔測試,Pad：,Text Pad/Breaking Tab,此類,Pad,僅供裝配完后作為測試點，不裝配零件。,不包括,SMT PAD,BGA PAD,Fiducial,mark pad.,8.,Breaking Tab：,印制板上無電氣性能，在制作過程中用于加工具孔、定位孔或,Dummy,等的部分。與線路板主體部分相連處有折斷孔或,V-Cut。,Breaking Tab,V-Cut,9.,Thermal,：,作用：,它使在焊接時因截面過分散熱而產(chǎn)生虛焊的可能性減少。,(,heat shield）,熱隔離盤 （,大面積導電圖形上，元件周 圍被蝕刻掉的部分）,

11、Thermal/Clearance,10.,Clearance：,無銅,空間（通常指銅皮上為孔開的無銅區(qū)域）,11.,S/M Bridge：,作用：,防止焊接時,Pad,間被焊錫短路。,阻焊橋（裝配,Pad,間的阻焊條）,S/M bridge,S/M Bridge,Solder mask in these areas,S/M bridge,12.,Gold finger：,金手指,說明：,電鍍金耐磨。,一般金指的,S/M OPENING,均為整體開窗。,13.,Key slot：,鍵槽,作用：,使印制板（金手指）只能插入與之配合的連接器 中，防止插入其他連接器中的槽口。,要求：,一般公差要求較

12、緊。,14.,Beveling：,金指斜邊,Gold finger/Key slot/Beveling,15.,VIP：,要求：,一般為,S,面塞孔，,C,面作為,SMT PAD。,16.,VOP：,(,Via In Pad)Via,孔位于,SMT Pad,上。,說明：,(,Via On Pad)Via,孔先被樹脂塞滿，其表面（一面或兩面）經(jīng)過打磨、沉銅、板電鍍等工序后，要求作為裝配,Pad。,VIP/VOP,S,面塞孔,SMT Pad,Via hole,樹脂塞孔,SMT Pad,Blind/Buried hole,17.,Blind/Buried hole：,盲,/,埋孔,盲孔：從一個表面開

13、始，在內(nèi)層結(jié)束，未貫穿整板的孔。,埋孔：不經(jīng)過兩外表面，只在某些內(nèi)層中貫穿的孔。,盲孔,埋孔,19,.LDI,High Density Interconnection :,高密度互聯(lián),-特點：直接用激光在干膜上曝光，不必用菲林，能保證完成線寬更細。,18,.HDI,Laser Direct Image-,鐳射直接曝光,-特點：一般線寬/線間小于3,mil/3mil,導通孔小于8,mil,microvia,一般,要求用激光鉆孔。,20.,Heat sink:,Side face,Bottom Side,Top Side,PCB,Pallet,大銅塊,Prepreg,PCB+,Prepreg,+P

14、allet,Aspect ratio,21.,Aspect Ratio：,縱橫比（板厚孔徑比）-影響電鍍和噴錫,說明：,一般采用板厚最大值與最小孔徑之比。,d,H,D,Aspect Ratio=d/H,22.,AGP:,顯卡,主顯示芯片,AGP,23.,Mother board:,內(nèi)存插孔,PCI,插槽,CPU,插座,AGP,插槽,主(機)板,Motherboard,24,.,Memory bank:,Memory bank,內(nèi)存條,內(nèi)存芯片組,第四篇：檢查與測試,歐盟,RoHS,&WEEE,指令對無鉛,PCB,要求,無鉛,PCB,必須滿足歐盟,RoHS,（Restriction of the

15、 use of certain Hazardous Substances in electrical and electronic equipment）2002/95/EC,指令 和電子信息產(chǎn)品生產(chǎn)污染防治管理辦法的規(guī)定，從2006年7月開始禁用六種物質(zhì),（鉛、鎘、六價鉻、水銀、,PBB（,多溴化聯(lián)苯）、,PBDE（,多溴聯(lián)苯醚）。其中,PCB,板主要檢測項目包括：,PCB,基材、阻焊、絲印、銅皮等。,If this specification conflicts with any other documents the following order of precedence shall

16、apply:,a),Purchase order,b),Printed wiring board drawings and drill and trim documentation,c),This specification,d),Documents referred to in this speciation.,Supplier shall use applicable fabrication panel coupon as defined in IPC-2221.Micro-sections coupon,and solder samples shall be provided with each shipment for validation requirement.,1.,Maximum 3 repair operations are allowed on each board and the number of repaired PCBS cannot exceed the 10 percent of the entire lot population.,2.,Unless